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圖形 - 印尼 - 進口 - 進化 - NCE: 半導體機械 - machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9 (c) to this chapter; parts and accessories: - 全年 FOB USD

圖形 - 印尼 - 進口 - 進化 - NCE: 半導體機械 - machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9 (c) to this chapter; parts and accessories: - 全年 FOB USD

表 - 印尼 - 進口 - 進化 - NCE: 半導體機械 - machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9 (c) to this chapter; parts and accessories: - 全年 FOB USD

Date
Export Countries
2020 2021 2022 2023 2024
中國大陸 2.932.037 4.179.977 7.754.307 24.888.073 110.970.494
日本 8.479.873 10.073.223 9.010.579 3.394.994 3.459.155
馬來西亞 3.336.123 3.920.397 6.680.104 3.883.323 4.516.056
泰國 695.283 2.241.539 2.217.516 3.267.849 826.675
韩国 1.057.000 1.197.000 1.304.000 1.663.000 743.000
美國 678.870 961.106 1.408.873 1.227.975 795.724
義大利 114.708 6.536 6.603 46.695 2.579.498
德國 162.905 275.307 60.506 941.776 67.337
台灣 13.000 11.000 142.000 955.000
荷蘭 129.125 296.221 488.269
Others 434.833 386.994 30 85.047 22.135
Total 18,020,758 23,255,078 28,453,518 39,836,951 125,423,342

圖形 - 印尼 - 進口 - 進化 - NCE: 半導體機械 - machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9 (c) to this chapter; parts and accessories: - 每月 FOB USD

圖形 - 印尼 - 進口 - 進化 - NCE: 半導體機械 - machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9 (c) to this chapter; parts and accessories: - 每月 FOB USD

表 - 印尼 - 進口 - 進化 - NCE: 半導體機械 - machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9 (c) to this chapter; parts and accessories: - 每月 FOB USD

Date
Export Countries
08 - 2024 09 - 2024 10 - 2024 11 - 2024 12 - 2024 01 - 2025
中國大陸 19.206.381 5.223.705 16.827.490 7.080.442 4.440.598 1.140.335
馬來西亞 450.985 166.654 213.966 299.545 152.640 244.261
日本 149.002 143.378 262.854 207.028 201.295 462.896
義大利 882.093 13.850
台灣 327.000 4.000 23.000 473.000 12.000
美國 22.034 187.870 245.440 109.866 15.274 165.975
韩国 17.000 42.000 40.000 38.000 142.000 54.000
泰國 181.351 115.014
德國 7.360 681 1.507 26.383 1.245
加拿大 20.674
Others 1.012
Total 19,846,414 6,980,060 17,789,632 7,780,063 5,451,191 2,195,727

圖形 - 印尼 - 出口 - 進化 - NCE: 半導體機械 - machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9 (c) to this chapter; parts and accessories: - 全年 FOB USD

圖形 - 印尼 - 出口 - 進化 - NCE: 半導體機械 - machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9 (c) to this chapter; parts and accessories: - 全年 FOB USD

表 - 印尼 - 出口 - 進化 - NCE: 半導體機械 - machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9 (c) to this chapter; parts and accessories: - 全年 FOB USD

Date
Import Countries
2020 2021 2022 2023 2024
日本 5.462.154 6.953.539 9.385.347 11.806.242 6.259.687
韩国 2.964.000 2.861.000 2.598.000 1.785.000 2.189.000
美國 86.447 119.628 2.905.189 2.085.883 279.609
台灣 440.000 474.000 688.000 1.012.000 373.000
馬來西亞 2.046.439 92.299 276.665 132.549 135.415
義大利 265.121 454.657 482.991 324.582 297.510
芬蘭 445.025
荷蘭 131.222 30.752 2.235 211.368 02
中國大陸 323.025 14.872 2.547 2.506 4.240
法國 60.979 36.489 5.836 129.375
Others 78.917 20.040 60.427 34.491 14.720
Total 12,303,329 11,057,275 16,407,237 17,523,997 9,553,182

圖形 - 印尼 - 出口 - 進化 - NCE: 半導體機械 - machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9 (c) to this chapter; parts and accessories: - 每月 FOB USD

圖形 - 印尼 - 出口 - 進化 - NCE: 半導體機械 - machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9 (c) to this chapter; parts and accessories: - 每月 FOB USD

表 - 印尼 - 出口 - 進化 - NCE: 半導體機械 - machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9 (c) to this chapter; parts and accessories: - 每月 FOB USD

Date
Import Countries
08 - 2024 09 - 2024 10 - 2024 11 - 2024 12 - 2024 01 - 2025
日本 471.674 398.966 739.563 453.309 121.814 204.381
韩国 220.000 205.000 311.000 227.000 273.000 293.000
美國 6.590 82.805 56.447
義大利 14.623 43.446 15.024 46.713
馬來西亞 36.689 14.262 13.641 3.055 15 266
台灣 43.000 2.000
德國 627 1.037 1.530
中國大陸 1.082 340 1.309 10
Total 744,695 669,641 1,082,067 773,087 479,635 554,094

圖形 - 印尼 - 進口 - 進化 / 出口 - 進化 - NCE: 半導體機械 - machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9 (c) to this chapter; parts and accessories: - 全年 FOB USD

圖形 - 印尼 - 進口 - 進化 / 出口 - 進化 - NCE: 半導體機械 - machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9 (c) to this chapter; parts and accessories: - 全年 FOB USD

表 - 印尼 - 進口 - 進化 / 出口 - 進化 - NCE: 半導體機械 - machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9 (c) to this chapter; parts and accessories: - 全年 FOB USD

Date
Export Countries
2020 2021 2022 2023 2024
Importaciones
中國大陸 2.932.037 4.179.977 7.754.307 24.888.073 110.970.494
日本 8.479.873 10.073.223 9.010.579 3.394.994 3.459.155
馬來西亞 3.336.123 3.920.397 6.680.104 3.883.323 4.516.056
泰國 695.283 2.241.539 2.217.516 3.267.849 826.675
韩国 1.057.000 1.197.000 1.304.000 1.663.000 743.000
美國 678.870 961.106 1.408.873 1.227.975 795.724
義大利 114.708 6.536 6.603 46.695 2.579.498
德國 162.905 275.307 60.506 941.776 67.337
台灣 13.000 11.000 142.000 955.000
荷蘭 129.125 296.221 488.269
Others 434.833 386.994 30 85.047 22.135
Total 18,020,758 23,255,078 28,453,518 39,836,951 125,423,342

Date
Import Countries
2020 2021 2022 2023 2024
Exportaciones
日本 5.462.154 6.953.539 9.385.347 11.806.242 6.259.687
韩国 2.964.000 2.861.000 2.598.000 1.785.000 2.189.000
美國 86.447 119.628 2.905.189 2.085.883 279.609
台灣 440.000 474.000 688.000 1.012.000 373.000
馬來西亞 2.046.439 92.299 276.665 132.549 135.415
義大利 265.121 454.657 482.991 324.582 297.510
芬蘭 445.025
荷蘭 131.222 30.752 2.235 211.368 02
中國大陸 323.025 14.872 2.547 2.506 4.240
法國 60.979 36.489 5.836 129.375
Others 78.917 20.040 60.427 34.491 14.720
Total 12,303,329 11,057,275 16,407,237 17,523,997 9,553,182

圖形 - 印尼 - 進口 - 進化 / 出口 - 進化 - NCE: 半導體機械 - machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9 (c) to this chapter; parts and accessories: - 每月 FOB USD

圖形 - 印尼 - 進口 - 進化 / 出口 - 進化 - NCE: 半導體機械 - machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9 (c) to this chapter; parts and accessories: - 每月 FOB USD

表 - 印尼 - 進口 - 進化 / 出口 - 進化 - NCE: 半導體機械 - machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9 (c) to this chapter; parts and accessories: - 每月 FOB USD

Date
Export Countries
08 - 2024 09 - 2024 10 - 2024 11 - 2024 12 - 2024 01 - 2025
Importaciones
中國大陸 19.206.381 5.223.705 16.827.490 7.080.442 4.440.598 1.140.335
馬來西亞 450.985 166.654 213.966 299.545 152.640 244.261
日本 149.002 143.378 262.854 207.028 201.295 462.896
義大利 882.093 13.850
台灣 327.000 4.000 23.000 473.000 12.000
美國 22.034 187.870 245.440 109.866 15.274 165.975
韩国 17.000 42.000 40.000 38.000 142.000 54.000
泰國 181.351 115.014
德國 7.360 681 1.507 26.383 1.245
加拿大 20.674
Others 1.012
Total 19,846,414 6,980,060 17,789,632 7,780,063 5,451,191 2,195,727

Date
Import Countries
08 - 2024 09 - 2024 10 - 2024 11 - 2024 12 - 2024 01 - 2025
Exportaciones
日本 471.674 398.966 739.563 453.309 121.814 204.381
韩国 220.000 205.000 311.000 227.000 273.000 293.000
美國 6.590 82.805 56.447
義大利 14.623 43.446 15.024 46.713
馬來西亞 36.689 14.262 13.641 3.055 15 266
台灣 43.000 2.000
德國 627 1.037 1.530
中國大陸 1.082 340 1.309 10
Total 744,695 669,641 1,082,067 773,087 479,635 554,094